Specifications:
1. X, Y,Z travel :650*550*250 mm;
2. Worktable size: 1700* 1000mm;
3. Precision:<0.01mm;
4. Optimal processing surface roughness:<0. 1 um;
5. Spindle head stroke:300 mm ;
6. Electrode plate to table distance:260-860mm;
7. Water tank capacity:900L;
8. Maximum working current:60A;
9. Processing speed:400mm‘3/min;
10. Max. load:2200kg;
11. Voltage:3 phase50.Hz,380V;
12. Power:4KW;
13. Dimensions:2150* 1800*2500 mm;
14. Weight:4000 kg.

Functions decription:

1. The ultra-high-speed CPU is used as the core of the discharge circuit, and the discharge gap is sampled 20 million times per second, which can make the best adjustments to the discharge intime to make the discharge morestable

2. The hardware detection loop can be turned on, and the hardware will automatically complete the servo tracking, which is more effective in small area deep holeprocessing.

3. The main CPU adopts industrial-grade low-power CPU, which can work stably even without a fan.

4. Provide 10,000 sets of file storage, which can store 10,000 different mold processingconditions. Multi-group machining coordinate memoryfunction.

5. Humanized operation, 3D interface display, different display information categories are placed on different pages, you can turn pages and operate at anytime.

6. With 10 segments of automatic fine-tuning function. You can: (1) Self-editing: Edit the processing conditions according to personal experience; (2) AUTOZ automatic editing: Given the maximum depth initial current and the finished thickness selection, the processing conditions will be automatically adjusted Editing is complete; (3) Intelligent condition editing: As long as you select the electrode shape, electrode and workpiece material, electrode cross-sectional area, and the thickness and depth setting after processing, the processing conditions will be automatically edited. The above three editing methods are all It can be processed by rough—medium—fine onetime.

7. Modify system parameters, X. Y.Z axis coordinates can be switched between metric system and inch system.

8. Discharge conditions are automatically adjusted. When the discharge is unstable, the computer will automatically modify the discharge efficiency and working time, and the dischargeconditions will automatically recover after stabilization. The processing conditions can be modified and adjusted at any time duringprocessing.

9. Automatic anti-carbon deposition detection function. When the carbon deposition processis unstable, the computer automatically adjusts the processing parameters and increases the slag discharge height, and automatically restores when it isstable.

10. It can be set to discharge 2~10 times to pull up to any set position and then continueprocessing, which has a good slag removal effect for deep hole processing.

11. It has the function of eliminating secondary discharge and fast pulling up of carbon deposit or fast pulling up function of discharge edgeseeking.

12. With energy control function, the processing effect can be more uniform. The energy controlcan be turned off to make graphite processingfaster.

13. The newly designed power box conforms to the European CE safety standards, which can be dustproof, waterproof, anti-interference, and improve the life of the electronicboard.

14. Adopt industrial-grade PC-BASE controller and adopt DOM new memory to replace traditional hard disk, which can read files faster and more stable and more suitable for industrialuse.

15. With upward discharge machining function. Make special workpiece processingeasier.

16. It has two independent machining coordinate systems. The male and female molds canbe divided or processed in different coordinatesystems.

17. After power off, restart the system and automatically load the last processing conditions and processing coordinates. You can directly press the wire control box to discharge withoutpressing any buttons on thepanel.

18. The pulling speed is divided into sections to increase the servo speed while ensuring that the electrode is not deformed, and improve the efficiency of large-areaprocessing.

19. Coordinates and processing data are stored separately, and the same processing conditionscan be quickly added in different coordinateprocessing.